Solvent-free Epoxy Light Filler Paste
GSM 874
DEFINITON
Solvent-free Epoxy Light Filler Paste
ADVANTAGES
Since it does not contain solvents, it does not cause shrinkage or sagging. It can be applied in thick layers and does not sag. When a spatula or a similar tool is used to smooth the surface, the paste does not come off the surface together with the tool.
APPLICATION AREAS
GSM 874 is a solvent-free, epoxy-based, two-component, low-density repair and filler paste. It is used as a repair and filler paste on wood, sheet metal, and CTP surfaces.
DR123456TK
ADVANTAGES
Since it does not contain solvents, it does not cause shrinkage or sagging. It can be applied in thick layers and does not sag. When a spatula or a similar tool is used to smooth the surface, the paste does not come off the surface together with the tool.
DR123456TK
